The complete F4B laminate family explained — from standard F4B and F4BM to ceramic-filled F4BTM and WL bonding sheets, with model numbers and typical uses for every series.
Xincheng’er Electronics has over 15 years of experience manufacturing high-frequency, microwave, and RF printed circuit boards. Our extensive portfolio of PTFE and ceramic-based laminates and substrates ensures engineers and designers can find the optimal material for both prototyping and mass production.
Whether you are developing advanced RF circuits or high-speed communication boards, F4B materials are built to deliver consistent performance, low dielectric loss, and superior thermal stability.
These standard F4B laminates offer excellent high-frequency performance across a wide range of RF applications. The suffix digits indicate the dielectric constant — F4B255, for example, sits at Dk 2.55.
The F4BM series combines PTFE with reinforced glass fabric for improved mechanical strength and low dielectric loss, making it a solid choice for multilayer RF boards.
F4BME laminates are engineered for high-frequency circuits that need ultra-stable dielectric properties, holding performance steady in demanding environments.
These ceramic-filled PTFE substrates provide superior thermal conductivity and reduced dielectric constant variation — a strong fit for microwave and RF applications.
These materials feature ultra-thin ceramic films for enhanced high-frequency performance and compact circuit designs — and, together with the WL bonding sheets below, they are specifically designed for multilayer builds.
The F4BTMS series is engineered for ultra-fine RF circuits that require minimal signal loss and consistent impedance across the board.
These composites are ideal for microwave-frequency circuits, balancing mechanical strength against dielectric performance.
These bonding sheets are made for multilayer high-frequency boards, providing reliable adhesion and thermal stability through successive lamination steps.
To see how F4B stacks up against imported laminates, browse our high-frequency PCB materials inventory, or learn how these materials behave in real layouts from our high-speed board design guide.
Quick answers on choosing and using F4B PTFE laminates
F4B is a standard PTFE glass fiber laminate, while F4BM includes additional reinforcement for better mechanical strength and stability in high-frequency applications.
Yes, series like F4BM-2-A, F4BME-2-A, and WL-PP bonding sheets are specifically designed for multilayer high-frequency PCBs.
F4BTM, F4BTME, TFA, TP, and TF series offer optimal performance for microwave circuits due to their stable dielectric properties and low signal loss.
Consider dielectric constant, loss tangent, thermal conductivity, and mechanical strength. Our experts at Xincheng'er can help you select the ideal material for your project.
Send us your required dielectric constant, thickness, and copper foil — we will match the right F4B series and quote quickly.
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