Frequently Asked Questions

We offer a variety of high-frequency materials, including Rogers RO4350B, RO4003C, RO3003, and RT/duroid 5880 (RT5880), as well as Taconic and F4B PTFE laminates, depending on customer requirements.

Yes. We provide detailed manufacturer datasheets for every material we use, so your engineering team can review Dk, Df, and other key parameters before making a decision.

Yes. We regularly build hybrid stackups that combine FR-4 with high-frequency laminates, giving you RF performance where it matters and cost efficiency where it doesn’t.

ENIG, gold plating, immersion silver, silver plating, HASL, gold fingers, OSP, nickel-palladium gold, resin plugging, countersinking, ENIG + hard gold plating, ImNi + ImTin, and ENIG + OSP.

ENIG is our recommended choice: its flat surface ensures consistent impedance, and it offers excellent conductivity and oxidation resistance for high-frequency use.

Up to 110 GHz, depending on the design and material selection. Share your target frequency with us and we’ll recommend a suitable stackup.

Through precise stackup design, impedance simulation before production, and controlled manufacturing with TDR testing on finished boards.

The main constraints are minimum trace width/spacing and material selection, which depend on your design requirements. Send us your files and we’ll flag any manufacturability issues before production.

We improve thermal performance with high thermal conductivity materials (e.g., metal-based PCBs), optimized copper thickness, and thermal via design.

Depending on the material, thermal conductivity ranges from 0.2 W/m·K (standard laminates) to 1.0 W/m·K for specialized high-conductivity options.

We produce high-frequency PCBs from 2 to 72 layers.

Yes — multilayer RF boards are one of our specialties, including hybrid stackup and blind/buried via constructions.

Thickness tolerance is ±0.05 mm; trace width tolerance is ±10%. Tighter tolerances are available on request.

By combining low-loss materials with optimized manufacturing processes and strict control of board thickness, copper roughness, and other critical parameters.

Every board is electrically tested before shipment. We also perform impedance testing, RF performance testing, and vacuum thermal testing as required by the application.

Reliability comes from high-quality base materials, rigorous process control, and 100% electrical testing before shipment — backed by our ISO-certified quality system.

Yes. Our boards endure reflow temperatures up to 260°C, and material selection can be tailored for harsh, high-humidity environments.

Prototypes typically ship in 2–7 business days; mass production takes 6–15 business days, depending on order volume and complexity.

High-frequency laminates (e.g., Rogers) cost more than FR-4, and each additional layer increases complexity. We’ll suggest cost-optimized alternatives — such as hybrid stackups — without sacrificing performance.

Boards are sealed in anti-static bags, vacuum-packed with desiccant, and cushioned with shockproof padding inside rigid outer cartons.

We ship worldwide via air freight, express delivery (DHL preferred), and sea freight — and we confirm the best option for your deadline and budget before dispatch.