High-Frequency Low-Loss
From 900 MHz IoT modules to 28 GHz 5G radios, RF boards reward precision and punish guesswork. We build impedance-controlled RF boards on your specified laminates — with every panel coupon-tested before shipment.
Decisions that belong in your design phase — we confirm all of them at DFM before production.
50 Ω single, 100 Ω differential, or custom — we model and confirm stack-up feasibility at DFM stage.
Dk sets size, Df sets loss, price sets BOM — we stock all four brand families to give you real options.
Balanced copper and dielectric reduce warp and keep impedance stable through reflow.
Solder mask and finish thickness shift impedance; we account for both in the modeled value.
The failure modes that ruin rf builds elsewhere; these are controlled steps on our floor.
Impedance drifts with etch and plating variation — we verify per panel, not per batch.
RF power sections with heavy copper need compensated artwork; we review and adjust at DFM.
Mask loading detunes mmWave lines — mask-free RF zones are planned, not improvised.
Dielectric thickness ± tolerance × layer count adds up; we quote achievable impedance windows upfront.
Capability-backed reasons — every number on this page comes from our own process capability sheet.
Impedance is measured and reported, not assumed.
RF layer where it counts, FR-4 everywhere else — 30–60% material savings.
Engineering replies within 24 hours, including stack-up corrections.
ENIG, OSP, immersion silver and more — chosen for your assembly process, not our convenience.
Keep exploring the capability chain — most projects touch more than one of these.
Upload your Gerber files. Our engineers reply within 24 hours with layer count, material, impedance tolerance and lead time — free DFM review included.
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