High-Frequency Low-Loss
Standard production limits. Most “extreme” values go higher — send us your stack-up for a definitive answer.
Six controlled stages — each with its own inspection gate before the board moves on.
Your Gerbers are checked for stack-up, impedance targets, annular ring and manufacturability. Issues reported before anything is produced.
Laminate cut to panel and multilayer lay-up pressed under controlled temperature and pressure — up to 3 lamination cycles for blind/buried via structures.
Mechanical drilling down to 0.15 mm plus CO2 laser vias (4–6 mil) for HDI. Backdrilling available for high-speed designs.
Electroless and electrolytic copper to spec — inner layers 1/3 to 12 oz, outer finished 1 to 13 oz (HOZ–30 oz for special builds) — then pattern etch.
Solder mask, carbon ink, silkscreen and laser-marked 2D codes. Gold fingers plated where required.
Seven finishes: HASL (lead-free), ENIG, nickel-palladium-gold, hard gold, OSP, immersion silver, immersion tin. 100% e-test, AOI and final QC.
Eight focused services — each page covers design rules, process challenges and our specific capability for that board type.
PTFE and ceramic-filled laminates, tight etch control, low-loss builds.
RF front ends and modules — impedance-controlled, coupon-tested builds.
4–32 layers with blind/buried vias, up to 3 lamination cycles.
High/low-Dk substrates, tight thickness tolerance for repeatable patterns.
RO4000, RO3000 and RT/duroid series, with Rogers + FR-4 hybrids.
TLY, TLT, RF and CER series for filters, LNAs and GPS antennas.
Inner copper to 12 oz and outer to 30 oz for power modules.
SMT and through-hole on HF boards — BGA, QFN and fine-pitch capable.
The differentiators that most factories outsource — we run these in-house.
Removes unused via stubs on high-speed channels — critical for 10G+ signal integrity.
Plugged and capped vias for via-in-pad BGA designs and stacked microvias.
1–6 build-up steps with laser microvias at 4–6 mil for dense mmWave layouts.
Hard-gold edge connectors and carbon print contacts, plus laser-marked 2D codes.
Upload your Gerber and stack-up files. Our engineers confirm layer count, material, impedance tolerance and lead time within 24 hours — free DFM review included.
Request a Quote