Precise Etching-Advanced Plating
Heavy Copper PCBs feature 4 oz/ft² to 20 oz/ft² copper layers, requiring precise etching, advanced electroplating, and robust lamination for optimal current capacity and thermal management in high-power applications.
Power modules, EV chargers and high-current RF need copper that ordinary fabs outsource — or refuse. We plate and etch extreme copper in-house: inner layers to 12 oz, outer finished copper HOZ to 30 oz.
Decisions that belong in your design phase — we confirm all of them at DFM before production.
Ampacity tables assume uniform etch — at 10+ oz, edge compensation matters; we review artwork at DFM.
Heavy copper is also a heat sink — plane pours double as cooling when planned early.
High-current vias need fills and stitching; resin and copper filling are in-house.
Signal layers 1 oz, power layers 10 oz on one board — plating is selectively controlled.
The failure modes that ruin heavy copper builds elsewhere; these are controlled steps on our floor.
Thick copper over-etches sideways — compensated artwork and adjusted resist hold trace geometry.
30 oz edges plate thicker than centers; pattern plating strategy is engineered per panel.
Mask dams break on tall copper — mask strategy is reviewed, not assumed.
Copper and FR-4 expand differently; balanced construction prevents warp at reflow.
Capability-backed reasons — every number on this page comes from our own process capability sheet.
No outsourcing loop — 12 oz inner / 30 oz outer on our own line.
Power and fine-pitch signal on one board, sequential builds supported.
EV, charging and power-module builds are routine production, not experiments.
High-current boards are e-tested — including isolation checks — before shipping.
Keep exploring the capability chain — most projects touch more than one of these.
Upload your Gerber files. Our engineers reply within 24 hours with layer count, material, impedance tolerance and lead time — free DFM review included.
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