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High-Frequency PCB Insights & Resources

Technical guides, material comparisons and process insights on high-frequency, RF and microwave PCB manufacturing.

PCB cross-section highlighting the insulation layer between copper planes with callouts for heat, CTE, flame resistance and dielectric properties

Insulation layer in PCB manufacturing: It isolates conductive layers, ensuring electrical insulation and signal integrity.

Four copper traces of increasing width carrying growing current, with an impedance dial, voltage bar and a magnified etched trace profile

PCB manufacturing, route width refers to what, performance and role?

3D printer depositing a printed shielding wall and thermal structure onto a high-frequency board for rapid prototyping

3D Printing Equipment in High-Frequency PCB Manufacturing (For Rapid Prototyping)

RO4350B and RO4003C laminate cross-sections under dial panels with filler textures, thermal expansion symbol and a high-frequency axis

 Rogers RO4350B/RO4003C Material Dielectric Constant Parameters

Five process standard badges for low-loss microwave PCB manufacturing covering material certification, imaging, etching, lamination and traceability

5 Key Process Standards for Low-Loss Microwave PCB Manufacturing

Five high-frequency PCB process focus areas in a ring: substrate selection, impedance control, dielectric uniformity, drilling and plating, and surface cleanliness

Key Focus Areas and Precautions in the High-Frequency PCB Manufacturing Process

RT/Duroid 5870 and 5880 PTFE High-Frequency Circuit Boards
RT/duroid 5880 laminate connecting a millimetre-wave front-end, radar unit and high-speed digital board with a flat low-loss line

 Rogers 5880 Empowers Millimeter-Wave and High-Speed Designs with Ultra-Low Loss

Two high-dielectric RT/duroid laminates compared back to back with heat and cost markers over their loss curves

Differences Between Rogers RT/duroid® 3210 and RT/duroid® 3010

A decision fork between process-friendly RO3010 and PTFE-based RO6010 laminates, with cost and laboratory icons over a shared low-loss line

Rogers RO3010 vs. RO6010 – How to Choose the Best Foundation for Your RF Circuit

RT6010LM high-dielectric laminate panel with a high-reading dial, a flat low-loss curve and phased array, automotive radar and instrument applications

Unique Advantages of Rogers RT6010LM

RO3210 hydrocarbon laminate panel with four gauges, a compact folded antenna and a flat low-loss curve

Unique Advantages of Rogers RO3210

PCB Assembly

  • Prototype PCB Assembly
  • Turnkey PCB Assembly
  • Flex PCB Assembly
  • Box Build Assembly
  • Contract Manufacturing
  • Through-hole Assembly
  • BGA Assembly
  • Quick Turn PCB Assembly
  • Low Volume PCB
  • PCB Assembly FAQ
  • PCB Assembly Process

PCBA Services

  • PCB Stencil
  • Components Sourcing
  • IC Programming
  • Conformal Coating
  • Selective Soldering
  • BGA Reballing
  • No Clean Flux
  • Cable Assembly
  • Wire Harness Assembly

Quality

  • Quality Control
  • DFA Check
  • A.O.I.
  • E-Test
  • X-Ray Inspection
  • Flying Probe Test
  • In-Circuit Testing
  • Functional Testing
  • 3D Solder Paste Inspection
  • First Article Inspection

Application

  • Industrial PCB
  • Automotive PCB
  • Medical PCBA
  • Aerospace PCB
  • Lighting PCB
  • Consumer Electronics
  • Telecommunication PCB
  • Military and Defense
  • Security Equipment
  • IOT PCB
  • Power and New Energy

Resources

  • Panel Requirements for Assembly
  • Required Files for PCBA
  • IPC standard for assembly
  • PCB Files Format
  • PCB Design
  • Schematic to PCB

Printed Circuit Board

  • PCB Prototype
  • Quick turn PCB Fabrication
  • Multilayer PCB
  • HDI PCB
  • Flexible PCB
  • Rigid Flex
  • Ceramic PCB
  • Heavy Copper PCB
  • Antenna PCB
  • High Frequency PCBs
  • Metal Core PCB
  • Glass PCB
  • High-TG PCB
  • PCB Impedance Control
  • LED PCB

RF PCB

  • Rogers PCB
  • Taconic PCB
  • Teflon PCB
  • Arlon PCB
  • Nelco PCB
  • Megtron PCB
  • ISOLA PCB

Quality

  • Quality Control
  • PCB DFM Check
  • A.O.I
  • E-Test
  • X-Ray
  • Flying Probe Test

PCB Surface Finish

  • HASL Lead Free
  • Immersion Gold(ENIG)
  • Gold Plating(Hard Gold)
  • ENEPIG
  • OSP PCB
  • Immersion Tin
  • Immersion Silver

Printed Circuit Board

  • PCB Materials
  • Drilling
  • Etching
  • Plating
  • Lamination
  • Solder Mask
  • Silk Screen
  • Dry Film

Drills & Throughplating

  • Blind vias
  • Buried vias
  • Annular Ring
  • Half Hole PCB
  • Plated Slot
  • Via In Pad
  • Backdrill
  • Via Covering

Profiles

  • Milling
  • V-Scoring
  • Depaneling

PCB Stackup

  • Multi-Layer Laminated Structure
  • 4 Layer PCB Stackup
  • 6 Layer PCB Stackup
  • 8 Layer PCB Stackup
  • 10 Layer PCB Stackup
  • Flex PCB Stackup
  • Rigid Flex PCB Stackup
  • Aluminum PCB Stackup

Resources

  • Manufacturing Tolerances
  • Trace Impedance Calculator
  • RoHs Lead Free
  • PCB Shelf Life
  • PCB Engineering Questions
  • PCB Manufacturing FAQs