Df below 0.0018, Dk around 3.5, 300°C thermal stability — how RT6035HTC serves communications, radar, medical and automotive designs, and how it compares to RT/duroid 3006 and FR-4.
Low Dielectric Loss: RT6035HTC exhibits an extremely low dielectric loss (Df), typically less than 0.0018. This characteristic effectively reduces signal loss in high-frequency applications, ensuring the integrity and stability of signal transmission.
High Dielectric Constant: The dielectric constant (Dk) of this material is generally around 3.5, making it suitable for circuit designs that require a higher dielectric constant. This enables RT6035HTC to excel in compact circuit designs, helping to reduce circuit size.
Excellent Thermal Stability: RT6035HTC has a thermal weight loss temperature that can reach 300°C, making it suitable for long-term use in high-temperature environments. This characteristic is particularly advantageous for high-power applications such as power amplifiers and RF modules.
Low Coefficient of Thermal Expansion: This material has a relatively low coefficient of thermal expansion, which helps maintain stable electrical performance under temperature fluctuations. This is especially important in high-frequency circuit designs as it reduces signal distortion caused by temperature changes.
Good Mechanical Strength: RT6035HTC boasts outstanding tensile and compressive strength, making it resistant to deformation during processing and use. This allows it to withstand significant mechanical stress, making it suitable for complex circuit designs.
Superior Machinability: This material can be easily processed using laser cutting and precision machining, facilitating complex circuit layouts. This feature is particularly crucial for modern high-density circuit designs.
Excellent Chemical Stability: RT6035HTC exhibits good resistance to various chemicals, maintaining stable performance in harsh chemical environments. This makes it very versatile for industrial applications.
Moisture Resistance: The material possesses excellent moisture resistance, allowing it to operate reliably in high-humidity environments, ensuring that its electrical performance remains unaffected.
Comparison with RT/duroid® 3006: Compared to RT/duroid® 3006, RT6035HTC shows superior electrical performance, particularly in dielectric loss and thermal stability. Additionally, RT6035HTC’s higher dielectric constant makes it suitable for more compact circuit designs.
Comparison with FR-4: Although FR-4 materials are more cost-effective, RT6035HTC excels in high-frequency and high-power applications, meeting stricter performance requirements. Furthermore, RT6035HTC’s thermal stability and mechanical strength make it more reliable in harsh environments — see our FR-4 vs Rogers comparison for the full trade-off analysis.
Common questions about Rogers RT6035HTC.
Its thermal weight loss temperature reaches 300°C and its low CTE keeps electrical performance stable through temperature swings. Together these properties support long-term, reliable operation in power amplifiers and RF modules.
A dielectric constant of approximately 3.5 and a dissipation factor typically below 0.0018 — a combination that supports compact, low-loss high-frequency circuit designs.
RT6035HTC offers superior dielectric loss and thermal stability, and its higher Dk enables more compact circuit designs than RT/duroid 3006.
For high-frequency and high-power applications, yes — it meets far stricter performance requirements and is more reliable in harsh environments, though FR-4 remains more cost-effective for undemanding circuits.
Our high-frequency line processes Rogers laminates daily. Send us your RT6035HTC design for a fast quote and DFM feedback.
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