The same floor that built your board assembles it. SMT and through-hole on high-frequency substrates — including the soft PTFE laminates that general assemblers struggle with — with the fab and assembly feedback loop under one roof.
Decisions that belong in your design phase — we confirm all of them at DFM before production.
Specify filled vias under BGAs at fab time — we do both steps, so nothing is lost in translation.
ENIG and nickel-palladium-gold give flat, oxidation-free pads — plated on our line.
Fiducials, rails and scoring are planned for the assembly line, not added as an afterthought.
Soft laminates move at reflow temperatures; support and carriers are planned for PTFE builds.
The failure modes that ruin pcb assembly builds elsewhere; these are controlled steps on our floor.
Heavy copper and hybrid stack-ups warp if unsupported — carriers and fixtures are prepared per build.
Through-hole and SMD on the same HF board need a planned wave/selective strategy.
Some finishes attack silver or gallium parts — we flag conflicts at DFM, not at rework.
Reflow shifts nothing if the stack-up is symmetric — which we control at fab.
Capability-backed reasons — every number on this page comes from our own process capability sheet.
Bare board and assembly from one floor — no finger-pointing between vendors.
PTFE, hybrid and heavy-copper assemblies are routine, not edge cases.
Assembly feedback reaches the fab engineers directly — same building.
One order, one schedule — prototypes move from Gerber to assembled board without vendor handoffs.
Keep exploring the capability chain — most projects touch more than one of these.
Upload your Gerber files. Our engineers reply within 24 hours with layer count, material, impedance tolerance and lead time — free DFM review included.
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