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This 8-layer high-frequency PCB uses Isola Astra MT77 material and features a 1.2mm thickness. It is ideal for high-frequency light sensor applications, meeting IPC6012 Class 3 and IPC-A-600G Class 3 standards, ensuring excellent electrical performance and signal integrity.
| Number of layers | 8 |
|---|---|
| Material | Isola Astra MT77 |
| Board Thickness | 1.2 mm (47 mil) |
| Copper Thickness | 1 oz/ft² (35 µm) |
| Quanlity Standard | IPC6012 Class 3, IPC-A-600G Class3, or IPC-6015 |
| Dielectric Constant (Dk) | 3.54 |
| Dissipation Factor (Df) | 0.0027 |
| Product Type | High-Frequency Light Sensors |
Product Overview
This 8-layer PCB is built using Isola Astra MT77 material, specifically designed for high-frequency sensor applications. With a board thickness of 1.2mm, it is well-suited for high-frequency sensors, light sensors, and other precision devices. Its electrical performance is exceptional, meeting IPC6012 Class 3 and IPC-A-600G Class 3 standards, and it is widely used in applications requiring high-frequency signal transmission and minimal loss.
Product Specifications
Layers: 8 layers
Material: Isola Astra MT77
Board Thickness: 1.2mm (47 mil)
Copper Thickness: 1 oz/ft² (35 µm)
Quality Standard: IPC6012 Class 3, IPC-A-600G Class 3, IPC-6015
Dielectric Constant (Dk): 3.54
Dissipation Factor (Df): 0.0027
Product Type: High-Frequency Light Sensors
Manufacturing Process
This PCB is manufactured with high-precision techniques, ensuring accurate layer-to-layer connections and meeting the stringent requirements of high-frequency applications. Isola Astra MT77 material is used to achieve a low dissipation factor (Df of 0.0027) and a high dielectric constant (Dk of 3.54), resulting in outstanding signal transmission performance. The 1 oz/ft² (35 µm) copper thickness ensures high current carrying capacity and excellent conductivity.
Design Considerations
When designing this PCB, it is important to focus on signal integrity and thermal management. The materials and layer count ensure minimal signal loss during high-frequency signal transmission. Additionally, since it meets IPC6012 Class 3 and IPC-A-600G Class 3 standards, this product is ideal for high-reliability applications, particularly for high-frequency communication systems, sensors, and other advanced technologies.
Application Scenarios
This PCB is perfect for use in various high-frequency light sensor applications, including telecommunications, electronic sensors, RF modules, and more. In these fields, signal integrity and low loss are critical, and Isola Astra MT77 material offers excellent electrical performance to ensure minimal signal degradation in high-speed signal transmission. The 1.2mm board thickness and 1 oz/ft² copper thickness ensure that the product remains stable and reliable, fulfilling the requirements of high-frequency transmission.
Manufacturing Process and Quality Standards
The manufacturing process of this PCB strictly adheres to IPC6012 Class 3 and IPC-A-600G Class 3 standards, ensuring its reliability and performance under harsh conditions. With a low dissipation factor (Df) and a high dielectric constant (Dk), this product is ideal for applications requiring high-frequency transmission and low loss, making it well-suited for 5G communication, IoT, and other high-frequency signal applications.
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
