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Rogers 4350B Microwave PCB
Rogers 4350B Microwave PCBs are high-frequency printed circuit boards designed for RF and microwave applications. These boards offer excellent performance for high-speed designs, featuring low dielectric loss and stable dielectric constant, making them ideal for applications requiring reliable signal transmission at microwave frequencies.
Additional information
Number of layers | 2 |
---|---|
Material | Rogers 4350B |
Board Thickness | 1.524mm |
Copper Thickness | 1 oz/ft² (35 µm) |
Quality Standard | IPC6012 Class 3, IPC-A-600G Class3, or IPC-6015 |
Dielectric Constant (Dk) | 3.48 at 10 GHz |
Dissipation Factor (Df) | 0.0037 at 10 GHz |
Product Type | RF Microwave |
Rogers 4350B Microwave PCBs are specifically engineered for RF and microwave frequencies, providing superior electrical performance across a broad spectrum of applications. The dielectric material, Rogers 4350B, offers a low dielectric constant (Dk) of 3.48 with minimal variation across temperature and frequency, ensuring reliable signal integrity in high-speed and high-frequency circuits. The material exhibits low loss characteristics with a dissipation factor (Df) of 0.0037 at 10 GHz, making it ideal for applications such as antennas, power amplifiers, and other communication systems. With enhanced thermal performance and dimensional stability, Rogers 4350B PCB is widely used in industries like aerospace, defense, and telecommunications where precise and consistent signal transmission is critical. Additionally, the material is compatible with FR4 manufacturing processes, making it easier to integrate into standard PCB production lines.
Rogers 4350B PCB Technical Parameters and Manufacturing Process
Technical Parameters:
- Dielectric Constant (Dk):
Rogers 4350B has a stable dielectric constant of 3.48 (measured at 10 GHz), which varies minimally with temperature and frequency. This characteristic is critical for maintaining consistent signal propagation, especially in RF and microwave applications. - Dissipation Factor (Df):
The material has a low dissipation factor of 0.0037 at 10 GHz, which indicates minimal energy loss, making it ideal for high-frequency, high-power applications where signal integrity is essential. - Thermal Coefficient of Dielectric Constant (TCDk):
Rogers 4350B exhibits a very low TCDk value of +50 ppm/°C, ensuring consistent performance across a wide temperature range. - Thermal Conductivity:
With a thermal conductivity of 0.62 W/m·K, Rogers 4350B provides adequate heat dissipation, supporting its use in power amplifier circuits and other high-power applications. - Glass Transition Temperature (Tg):
The material has a Tg of over 280°C, which supports its ability to withstand high-temperature environments, maintaining dimensional stability during thermal cycling. - Copper Foil Thickness:
Rogers 4350B is compatible with a wide range of copper foil thicknesses, typically ranging from 0.5 oz/ft² to 2 oz/ft², offering flexibility in designing PCBs for varying current-carrying requirements. - Water Absorption:
With low water absorption of 0.06%, Rogers 4350B is ideal for applications in humid environments where moisture could otherwise degrade the dielectric properties.
Manufacturing Process:
- Lamination:
Rogers 4350B PCBs are typically laminated using standard high-frequency PCB processes. The material is compatible with most FR4 processes, meaning that it can be manufactured using standard PCB production equipment. The multilayer boards are created by laminating layers of Rogers 4350B material with pre-pregs and copper foils at elevated temperatures and pressures. - Etching:
After lamination, the copper layers are etched to form the circuit patterns. Due to the precision required for high-frequency circuits, strict control over etching parameters is essential to ensure accurate line widths and spacing. - Drilling:
High-speed drilling is used to create vias and through-holes. The material’s excellent dimensional stability ensures that hole tolerances are maintained even in complex designs. - Plating:
After drilling, the holes and vias are plated with copper to ensure electrical connections between layers. Rogers 4350B’s surface properties allow for excellent adhesion of copper during the plating process. - Solder Mask Application:
After plating, a solder mask is applied to protect the circuit traces from oxidation and to prevent solder bridges during component assembly. The smooth surface of Rogers 4350B supports even application of the solder mask. - Final Testing:
Completed PCBs undergo rigorous electrical and mechanical testing, including impedance measurements, to ensure they meet the design specifications for RF and microwave performance.
By combining these advanced parameters with precision manufacturing, Rogers 4350B PCB is tailored for high-performance, high-frequency applications such as telecommunications, automotive radar systems, and aerospace communication networks.
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