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This 1.6mm thick PCB uses Rogers RO3006 material and 1 oz copper, featuring an Immersion Silver finish. Designed for high-speed digital hybrid circuit boards, it meets IPC-6012 and MIL-PRF-31032 standards, with a dielectric constant of 6.15 @ 10GHz and a dissipation factor of 0.0025 @ 10GHz.
| Number of layers | |
|---|---|
| Material | Rogers RO3006 |
| Board Thickness | 1.6 mm / 63 mil |
| Copper Thickness | 1 oz/ft2 (35 ??m) |
| Quanlity Standard | IPC-6012, MIL-PRF-31032 |
| Dielectric Constant (Dk) | 6.15 @10GHz |
| Dissipation Factor (Df) | 0.0025 @10GHz |
| Applications | High-Speed Digital Hybrid Circuit Board |
| Surface Finish | Immersion Silver |
Product Overview
This 1.6mm thick PCB is built using Rogers RO3006 material and features 1 oz copper with an Immersion Silver surface finish. It is designed for high-speed digital hybrid circuit boards, making it ideal for use in advanced digital and communication systems. The PCB meets IPC-6012 and MIL-PRF-31032 quality standards, and its dielectric constant of 6.15 @ 10GHz and dissipation factor of 0.0025 @ 10GHz ensure superior performance in high-frequency applications.
Product Specifications
Layers: 1.6mm (63 mil) thickness
Material: Rogers RO3006
Copper Thickness: 1 oz/ft² (35 µm)
Surface Finish: Immersion Silver
Quality Standards: IPC-6012, MIL-PRF-31032
Dielectric Constant (Dk): 6.15 @ 10GHz
Dissipation Factor (Df): 0.0025 @ 10GHz
Application: High-Speed Digital Hybrid Circuit Board
Manufacturing Process
This PCB is manufactured using advanced technology to ensure precise layer alignment and superior electrical performance. Rogers RO3006 material is chosen for its low-loss characteristics and high-performance capabilities, especially in high-speed digital circuits. The Immersion Silver finish provides excellent solderability and protection against oxidation, ensuring long-lasting reliability in critical applications.
Design Considerations
When designing with this PCB, it is essential to optimize for high-speed signal transmission, as the low dissipation factor (Df) and high dielectric constant (Dk) ensure minimal signal loss and excellent signal integrity. The immersion silver finish enhances electrical performance and is ideal for high-frequency applications. Designers should also take into account factors like impedance control and trace width to ensure optimal performance in digital and communication devices.
Applications
This PCB is specifically designed for high-speed digital hybrid circuit boards. It is widely used in communication devices, radar systems, and other high-frequency applications that require stable signal transmission with low loss. It is ideal for applications in telecommunications, aerospace, and industrial sectors where performance and reliability are critical.
Manufacturing Process and Quality Standards
This PCB is manufactured to meet the stringent IPC-6012 and MIL-PRF-31032 standards, ensuring it performs reliably in high-speed, high-frequency applications. The use of Rogers RO3006 material guarantees excellent electrical properties, and the Immersion Silver surface finish ensures the PCB is resistant to corrosion and oxidation, improving its longevity and reliability. The low Df and high Dk values make this PCB perfect for advanced digital and hybrid circuits that require minimal signal attenuation.
We offer a variety of high-frequency materials, including Rogers (e.g., RO4350B, RO5880), Taconic, and PTFE, depending on customer requirements.
Absolutely, we can provide detailed datasheets for review.
Our high-frequency PCBs can support frequencies up to 110 GHz, depending on the design and materials used.
We ensure precise impedance control through accurate stackup design, detailed impedance simulations, and advanced manufacturing processes.
Yes, we can combine materials like FR4 and high-frequency laminates for hybrid PCBs.
Restrictions mainly involve minimum trace width/spacing and material selection, depending on your design requirements.
We enhance thermal performance by using high thermal conductivity materials (e.g., metal-based PCBs) and optimizing copper thickness.
Thermal conductivity ranges from 0.2 W/m·K to 1.0 W/m·K, depending on the material.
ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP
ENIG is recommended due to its flat surface and excellent conductivity for high-frequency use.
We can produce high-frequency PCBs with layers ranging from 2 to 72.
Yes, we specialize in multilayer high-frequency PCBs and support hybrid stackup processes.
The thickness tolerance is ±0.05 mm, and the trace width tolerance is ±10%.
We perform impedance testing, RF performance testing, vacuum thermal testing, and more.
We achieve this by using high-quality materials, optimized manufacturing processes, and strict control of board thickness and other parameters.
Answer: Prototypes typically take 2–7 business days, while mass production takes 6–15 business days, depending on order volume and complexity.
High-frequency materials (e.g., Rogers) are more expensive, and higher layer counts increase complexity and cost.
We ensure reliability by using high-quality materials, rigorous testing, and optimized manufacturing processes.
Yes, our PCBs can endure temperatures up to 260°C and are suitable for harsh environments.
We use anti-static bags, vacuum packaging, and shockproof padding in the outer cartons for protection.
We provide air freight, express delivery, and sea shipping, depending on your needs, DHL is always prefered that ensure timely delivery through reliable logistics.
