High Frequency high PRICESION
HF PCB Manufacturing
Specialized in High Frequecy PCBs: High Dielectric Constant, Blind and Buried Vias, RF&Microwave PCBs，Heavy Copper PCBs
About Us
HF PCB Factory Since 2009
As an original manufacturer in China, we offer cutting-edge high-frequency printed circuit board technologies and the highest quality standards for the electronics industry. HF PCB Pro is committed to meeting your needs, constantly pursuing technological leadership, and building an innovation lab and engineering team to tackle new design challenges: high speed and high capacity, RF and microwave, thermal management, miniaturization, and chip package substrates.
We specialize in RF and microwave solutions, high-speed and high-capacity solutions, and thermal management solutions for 5G, AI robotics, BMS, and more. Our technical capabilities include mechanical blind holes backplane, 72-layer double-side crimping backplane, multifunctional integrated copper combined board, ODU RF board, E-band ODU RF board, and more. Please send us your high-complexity RFQs for cost estimation.
HF PCB Manufacturing Projects
Rogers PCB
Rogers RO4350B Rogers RO4003C Rogers RT/duroid® 5880 Rogers RO3003 Rogers TMM® Series
High-frequency PCB
Rogers RO4000 Series Rogers RT/duroid® Series Rogers TMM® Series Isola IS620 Series Taconic TLY Series Arlon AD Series
Hyrid PCB
RO4350+FR4, RO3003 + FR4(2.4 GHz Wi-Fi), Taconic RF-35 + FR4(5 GHz Wi-Fi or Radar System),Rogers 5880 + Rogers 4350B, Rogers 4003C + FR4(Auto Radar)
Heavy Copper PCB
2oz ~10oz Copper PCB Single-Sided ，Double-Sided ，Multilayer，High-Power Heavy Copper Heavy Copper PCB
HF PCB Capability
Item | Description | Process Capability | General |
| Laminate | Type | Rogers/Taconic/Arlon/Isola/Nelco/CHUKOH/FR-4/F4B/TP-2/Hihg TG… | |
| Thickness | 0.1-12mm | ||
| Process Capability | Layer | 2-36 layers ratio frequency PCB, Hybrid PCB, Multilayer HDI PCB | |
| Surface Finish | ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP | ||
| Copper Foil Thickness | Completed Copper Thickness | 0.5oz-5oz | 1oz-3oz |
| Size | Max Panel Size | 480*800mm | 600*600mm |
| Drilling | Drilling Diameter | ≥0.1mm | ≥0.2mm |
| Aperture Tolerance | ±0.05mm | ±0.075-±0.08mm | |
| Hole Position Tolerance | ±0.05mm | ±0.075mm | |
nner Layer | Inner Core Thinkness | 0.1-4.0mm | 0.2-2.0mm |
Trace/Space | 2.5mil/3mil | 3mil/4mil | |
| Registration Precision | 2mil | 3mil | |
| Size | Plate Thickness Tolerance | ±0.1 | ±10% |
| Registration | ≤0.05mm | ≤0.1mm | |
| Electroless Plating Copper | Hole Wall Copper Thickness | 20um-50um | ≥20um |
| Profiling | Profile Type | Routing/Punching/V-CUT/Beveled Edges Laser Cutting | |
| Out Layer | Trace/Space | 2.5mil/3mil | 3mil/4mil |
| Etching | Tolerance | ±0.01mm | ±20% |
| Processing | BGA | ≥8mil | ≥12mil |
| IC | ≥3mil | ≥6mil | |
| Aspect Ratio | 14:01 | 10:01 | |
| Board Thickness | 0.1-10.0mm | 0.2-4.0mm | |
| Chemical Gold Plating/Electronic Plating | Nickel Thickness | ≥120u | |
| Gold Thickness | 1-5u | ||
| Solder Mask | Color | Green/Blue/Black/Red/White/Yellow | |
| Thickness | 15-35um | ||
| Solder Mask Bridge | ≥3mil | ≥5mil | |
| Plug Hole Diameter | 0.15-0.6mm | 0.3-0.4mm | |
| Legend | Color | Green/Blue/Black/Red/White/Yellow | |
| Trace Width/Space | 6mil/6mil | ||
| Impedance | Impedance Tolerance | ±10% | |
| Quality Control | Single and double Sided printed boards with plated-through holes technique standard GB4588.2-88, Design, and Use of Printed Boards IPC-A-600G IPC-6015 | ||