HF PCB Pro focuses on delivering high-frequency PCB solutions, offering advanced capabilities such as precise signal integrity, low loss transmission, and high-speed data handling.<br>
Capabilities in the context of high-frequency PCBs refer to the specific design and manufacturing abilities required to produce printed circuit boards that operate effectively at microwave and RF (Radio Frequency) frequencies, typically above 1 GHz. These capabilities include precise control over material properties, signal integrity, impedance matching, and thermal management, which are critical for maintaining performance at high frequencies.
Parameters | Custom Process Capability | Standarded |
---|---|---|
Chemical Gold Plating/Electronic Plating | Nickel Thickness ≥120u | |
Completed Copper Foil Thickness | 0.5oz-5oz | 1oz-3oz |
Drilling Diameter | ≥0.1mm | ≥0.2mm |
Drilling- Aperture Tolerance | ±0.05mm | ±0.075-±0.08mm |
Drilling- Hole Position Tolerance | ±0.05mm | ±0.075mm |
Electroless Plating Copper Hole Wall Copper Thickness | 20um-50um | ≥20um |
Etching Tolerance | ±0.01mm | ±20% |
Gold Plating Thickness | 1-5u | |
Impedance Tolerance | ±10% | |
Inner Core Thinkness | 0.1-4.0mm | 0.2-2.0mm |
Inner Layer Trace/Space | 2.5mil/3mil | 3mil/4mil |
Legend Color | Green/Blue/Black/Red/White/Yellow | |
Material Types | Rogers/Taconic/Arlon/Isola/Nelco/CHUKOH/FR-4/F4B/TP-2/High TG... | |
Maximum Board Size | 480*800mm | 600*600mm |
Outer Layer -Trace/Space | 2.5mil/3mil | 3mil/4mil |
Plate Thickness Tolerance | ±0.1 | ±10% |
Plug Hole Diameter | 0.15-0.6mm | 0.3-0.4mm |
Process Capability Layers | 2-72 layers radio frequency PCB, Hybrid PCB, Multilayer HDI PCB | |
Processing- BGA | ≥8mil | ≥12mil |
Processing- Board Thickness | 0.1-10.0mm | 0.2-4.0mm |
Processing- IC | ≥3mil | ≥6mil |
Processing-Aspect Ratio | 14:01 | 10:01 |
ProfilingType | Routing/Punching/V-CUT/Beveled Edges Laser Cutting | |
Quality Control | Single and double Sided printed boards with plated-through holes technique standard GB4588.2-88, Design and Use of Printed Boards IPC-A-600G IPC-6015 | |
Registration Precision | 2mil | 3mil |
Registration Tolerance | ≤0.05mm | ≤0.1mm |
Solder Mask Bridge | ≥3mil | ≥5mil |
Solder Mask Color | Green/Blue/Black/Red/White/Yellow | |
Solder Mask Thickness | 15-35um | |
Surface Finish Options | ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP | |
Thickness | 0.1-12mm | |
Trace Width/Space | 6mil/6mil |