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Precise Etching-Advanced Plating
Heavy Copper PCBs feature 4 oz/ft² to 20 oz/ft² copper layers, requiring precise etching, advanced electroplating, and robust lamination for optimal current capacity and thermal management in high-power applications.
A Heavy Copper PCB is a type of printed circuit board with copper thickness exceeding the standard 1 oz/ft² (35 µm). Typically, heavy copper PCBs have copper thicknesses ranging from 4 oz/ft² (105 µm) to 20 oz/ft² (700 µm) or more. These PCBs are used in applications where high current or enhanced heat dissipation is required.
| Type of Heavy Copper PCB | Performance Parameters | Specific Applications |
| Standard Heavy Copper PCBs | Copper Thickness: 3 oz/ft² to 10 oz/ft² | Power amplifiers, motor controllers, automotive RF systems |
| Impedance Control: Critical for maintaining signal integrity | ||
| Thermal Conductivity: Enhanced for better heat dissipation | ||
| Extreme Heavy Copper PCBs | Copper Thickness: Above 10 oz/ft², up to 20 oz/ft² or more | High-power RF distribution systems, industrial RF equipment |
| High Current Handling: Supports higher current loads without overheating | ||
| Superior Thermal Management: Optimal for extreme environments | ||
| Plated Heavy Copper PCBs | Combined Copper Thickness: Base copper + additional plated layers | High-power RF circuits, power converters with RF components |
| Electroplating: Increases overall copper thickness and durability | ||
| High-Frequency Stability: Ensures performance at higher frequencies |
Board Thickness: Consider thicker boards for mechanical stability with heavy copper layers.
Layer Stackup: Design a balanced layer stackup to prevent warping.
Consider etching tolerances; for heavy copper, the minimum trace width might be constrained to 0.3 mm, with a minimum spacing of 0.4 mm. Ensure that the PCB manufacturer can handle the increased etching times and material removal rates.
Estimate material costs based on copper weight, with higher weights (e.g., 10 oz/ft²) significantly increasing material and manufacturing expenses. Evaluate the cost-benefit ratio for the intended application.
Perform thermal cycling tests to assess long-term reliability, targeting minimal delamination or cracking over 1000+ cycles at temperature ranges from -40°C to 125°C. Use accelerated life testing to predict PCB lifespan under load conditions.
| Material Model | Heavy Copper PCB Characteristics | Specific Applications | Scenarios Requiring Use |
| FR-4 | Cost-effective, moderate thermal performance, suitable for up to 6 oz/ft² copper. | Power supplies, motor controllers, and industrial control systems. | Applications requiring moderate current and cost efficiency. |
| Rogers RO4000 Series | High thermal conductivity, stable dielectric properties, suitable for up to 10 oz/ft² copper. | RF power amplifiers, microwave circuits, and high-frequency power modules. | High-frequency applications requiring low dielectric loss and heat dissipation. |
| Isola P95 | Excellent thermal management, high mechanical strength, suitable for up to 12 oz/ft² copper. | Automotive power electronics, power converters, and inverters. | Environments with high mechanical stress and thermal demands. |
| Taconic TLY Series | Low dielectric constant, minimal signal loss, suitable for up to 10 oz/ft² copper. | High-frequency RF and microwave circuits. | Critical RF and microwave applications requiring minimal signal loss. |
| Panasonic R-1755V | High thermal reliability, excellent electrical properties, suitable for up to 8 oz/ft² copper. | Power modules, telecommunications equipment, and power converters. | Applications needing high thermal reliability and stable electrical performance. |
| Rogers RO3000 Series | Superior electrical performance, low dielectric loss, suitable for up to 20 oz/ft² copper. | High-power RF circuits, microwave power modules, and aerospace electronics. | Extreme high-frequency applications with significant power demands. |
Capability: The manufacturer must utilize subtractive etching techniques capable of handling copper weights up to 20 oz/ft². This requires precise control over etching parameters to avoid issues such as undercutting and over-etching, which can compromise the trace width tolerance.
Example: A power distribution PCB designed to handle 100A requires trace widths that remain consistent across the entire board, with tolerances as tight as ±10%. The etching process must be fine-tuned to maintain these tolerances even with copper thicknesses of 10 oz/ft².
Capability: Electrolytic plating processes must be optimized to ensure that through-holes and vias in heavy copper layers are uniformly plated, achieving consistent thickness and strong adhesion. This is particularly important for via-in-pad designs that require vias to carry significant current without increasing resistance.
Example: A high-current power converter PCB might require via-in-pad structures to connect thick copper layers across multiple layers. The plating process must ensure that these vias are fully filled and that the copper layer inside the via is uniform, preventing any potential for voids or cracks.
Capability: The manufacturer should be skilled in integrating thermal vias and embedded heat sinks within the PCB to efficiently manage heat dissipation. This involves careful design and placement to ensure effective heat flow from critical components to the board’s outer layers.
Example: In a high-power RF amplifier, components such as transistors generate significant heat. The PCB design might incorporate a buried copper plane as a heat sink, connected via multiple thermal vias to ensure efficient heat transfer away from sensitive areas, preventing thermal runaway.
Capability: Expertise in working with high-performance substrates like Rogers RO4000 or Isola P95 that maintain stability under high thermal and electrical stress. The ability to laminate these substrates with heavy copper layers without degrading their electrical properties is essential.
Example: A microwave power module operating at 2.4 GHz requires a substrate like Rogers RO4350B with a low dielectric constant and high thermal conductivity. The heavy copper layers must be laminated without increasing the dielectric loss, which could degrade signal integrity at high frequencies.
Capability: Sequential lamination techniques must be employed to bond multiple heavy copper layers with dielectric materials. This requires precise control of lamination pressure and temperature to prevent delamination and ensure uniform copper distribution.
Example: A multi-layer PCB designed for electric vehicle battery management systems may require sequential lamination to build up copper thickness across layers while maintaining tight tolerances on dielectric spacing. This process must ensure that no resin squeeze-out occurs, which could lead to shorts or insulation failures.
Capability: Advanced quality control processes, such as X-ray inspection and cross-section analysis, are needed to verify the integrity of thick copper layers and plated through-holes. This includes ensuring there are no voids, cracks, or plating defects that could compromise performance under high load.
Example: After manufacturing a heavy copper PCB for a high-current power supply, the manufacturer might conduct cross-sectioning of the PCB to inspect the copper thickness, via fill quality, and adhesion of the copper to the substrate. This ensures the board can handle the specified current without failure.
Capability: The manufacturer should have a proven track record of producing heavy copper PCBs for high-current applications, such as power distribution units, motor drives, and industrial automation systems. This experience translates into an understanding of the unique challenges posed by high-current densities and thermal management.
Example: A heavy copper PCB used in an industrial motor controller must be capable of withstanding continuous high current (e.g., 200A) without overheating. The manufacturer’s experience with similar high-power designs ensures the PCB can operate reliably in demanding industrial environments.
