Type： Rogers/Taconic/Arlon/Isola/Nelco/CHUKOH/FR-4/F4B/TP-2/High TG…
Thickness：0.1~12mm
High Frequency high precison
HF PCB Capability
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HF PCB Pro focuses on delivering high-frequency PCB solutions, offering advanced capabilities such as precise signal integrity, low loss transmission, and high-speed data handling.
Laminates
Process Capability
Surface Finish
Copper Foil Thickness
Maximum Panel Size
Maximum Panel Size
Drilling
Inner Layer
Tolerance
Electroless Plating Copper
Outer Layer
Etching
Processing
Chemical Gold Plating / Electronic Plating
Solder Mask
Legend
Impedance
Quality Control
Laminates
Process Capability
Layer：2~36 layers radio frequency PCB, Hybrid PCB, Multilayer HDI PCB
Surface Finish
ENIG
Gold Plating
Immersion Silver
Silver Plating
HASL
Gold finger
OSP
Nickel palladium Gold
Resin plugging
Countersinking
ENIG+Hard Gold Plating
ImNi+ImTin
ENIG+OSP
Copper Foil Thickness
Completed Copper Thickness ： 0.5oz~5oz
Maximum Panel Size
480*800mm
Maximum Panel Size
480*800mm
Drilling
Drilling Diameter ： ≥0.1mm
Aperture Tolerance：±0.05mm
Hole Position Tolerance： ±0.05mm
Inner Layer
Inner Core Thickness： 0.1~4.0mm
Trace/Space： 2.5mil/3mil
Registration Precision：2mil
Tolerance
Plate Thickness Tolerance： ±0.1
Registration Tolerance： ≤0.05mm
Electroless Plating Copper
Hole Wall Copper Thickness : 20um~50um
Outer Layer
Trace/Space： 2.5mil/3mil
Etching
Tolerance： ±0.01mm
Processing
BGA ≥8mil
IC ≥3mil
Aspect Ratio 14:01
Board Thickness 0.1-10.0mm
Chemical Gold Plating / Electronic Plating
Nickel Thickness： ≥120u
Gold Thickness： 1-5u
Solder Mask
Color :Green/Blue/Black/Red/White/Yellow
Thickness: 15-35um
Solder Mask Bridge: ≥3mil
Plug Hole Diameter: 0.15-0.6mm
Legend
Color: Green/Blue/Black/Red/White/Yellow
Trace Width/Space: 6mil/6mil
Impedance
Impedance Tolerance: ±10%
Quality Control
Single and double Sided printed boards with plated-through holes technique standard GB4588.2-88, Design and Use of Printed Boards IPC-A-600G IPC-6015
Item | Desc | Process Capability | General |
| Laminate | Type | Rogers/Taconic/Arlon/Isola/Nelco/CHUKOH/FR-4/F4B/TP-2/High TG… | |
| Thickness | 0.1-12mm | ||
| Process Capability | Layer | 2-36 layers ratio frequency PCB, Hybrid PCB, Multilayer HDI PCB | |
| Surface Finish | ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP | ||
| Coper Foil Thinknes | Completed Copper Thickness | 0.5oz-5oz | 1oz-3oz |
| Size | Max Panel Size | 480*800mm | 600*600mm |
| Drilling | Drilling Diameter | ≥0.1mm | ≥0.2mm |
| Aperture Tolerance | ±0.05mm | ±0.075-±0.08mm | |
| Hole Position Tolerance | ±0.05mm | ±0.075mm | |
| Inner Layer | Inner Core Thinkness | 0.1-4.0mm | 0.2-2.0mm |
| Trace/Space | 2.5mil/3mil | 3mil/4mil | |
| Registration Precision | 2mil | 3mil | |
| Size | Plate Thickness Tolerance | ±0.1 | ±10% |
| Registration | ≤0.05mm | ≤0.1mm | |
| Electroless Plating Copper | Hole Wall Copper Thickness | 20um-50um | ≥20um |
| Profiling | Profile Type | Routing/Punching/V-CUT/Beveled Edges Laser Cutting | |
| Out Layer | Trace/Space | 2.5mil/3mil | 3mil/4mil |
| Etching | Tolerance | ±0.01mm | ±20% |
| Processing | BGA | ≥8mil | ≥12mil |
| IC | ≥3mil | ≥6mil | |
| Aspect Ratio | 14:01 | 10:01 | |
| Board Thickness | 0.1-10.0mm | 0.2-4.0mm | |
| Chemical Gold Plating/Electronic Plating | Nickel Thickness | ≥120u | |
| Gold Thickness | 1-5u | ||
| Sodler Mask | Color | Green/Blue/Black/Red/White/Yellow | |
| Thickness | 15-35um | ||
| Solder Mask Bridge | ≥3mil | ≥5mil | |
| Plug Hole Diameter | 0.15-0.6mm | 0.3-0.4mm | |
| Legend | Color | Green/Blue/Black/Red/White/Yellow | |
| Trace Width/Space | 6mil/6mil | ||
| Impedance | Impedance Tolerance | ±10% | |
| Quality Control | Single and double Sided printed boards with plated-through holes technique standard GB4588.2-88, Design and Use of Printed Boards IPC-A-600G IPC-6015 | ||