High Frequency high Precison

High Frequency Laminates

HF PCB Pro has all kinds of brands of materials in stock to ensure reliable capablities, among the table below , we can quote a more favorable prices in the market.

When selecting PCB materials, several key characteristics must be considered to ensure optimal performance and reliability for the intended application. Here are some of the most important factors:

1. Dielectric Constant (Dk or εr)

The dielectric constant measures the material’s ability to store electrical energy in an electric field. It affects the signal propagation speed and impedance of the transmission lines. A lower dielectric constant is generally preferred for high-frequency applications as it results in lower signal loss.

2. Loss Tangent (Df or tan δ)

The loss tangent indicates the amount of signal loss due to the dielectric material. A lower loss tangent is crucial for high-frequency and high-speed digital applications because it reduces signal attenuation and distortion.

3. Thermal Conductivity

This property determines the material’s ability to dissipate heat. Materials with high thermal conductivity are essential for high-power applications or designs with dense components, as they help manage thermal performance and prevent overheating.

4. Glass Transition Temperature (Tg)

When designing high-frequency PCBs, it’s essential to consider the Glass Transition Temperature (Tg) because exceeding this temperature can lead to the substrate softening, causing dimensional instability, warping, and changes in electrical properties like impedance. Ensuring the Tg is well above the operating temperature helps maintain the board’s mechanical and electrical performance, which is crucial for reliable signal transmission in high-frequency applications.

5. Coefficient of Thermal Expansion (CTE)

CTE measures how much the material expands or contracts with temperature changes. A low CTE is desirable, especially in high-reliability applications, as it minimizes stress on the PCB and components during thermal cycling, preventing mechanical failures.

6. Mechanical Strength and Rigidity

Mechanical properties such as tensile strength and modulus of elasticity determine the material’s durability and its ability to withstand mechanical stress without deforming. This is important in applications where the PCB will experience mechanical loads or vibrations.

7. Moisture Absorption

The ability of the PCB material to resist moisture absorption affects its electrical and mechanical properties. Low moisture absorption is critical for maintaining stable electrical characteristics and preventing delamination or degradation in humid environments.

8. Flame Retardancy

Materials should meet specific flame retardancy standards (such as UL94) to ensure safety in case of fire. Flame retardant materials prevent the spread of flames, providing extra time for equipment shutdown and evacuation.

9. Cost and Availability

The cost and availability of materials can significantly impact the overall project budget and production timeline. It’s essential to balance material performance with budget constraints and ensure that the chosen material can be sourced reliably in the required quantities.

10. Compatibility with PCB Manufacturing Processes

The material must be compatible with standard PCB manufacturing processes, including etching, plating, drilling, and soldering. It should also support the required layer count and feature sizes, especially for high-density designs.

These characteristics must be carefully evaluated based on the specific needs of the application, ensuring that the selected material provides the necessary performance while maintaining reliability and cost-effectiveness.

Brand	Model	Standard Thinkness (Metal layer excluded) (mm)	Dielectric Loss	DK
F4B	F4BM220	0.127/0.254/0.508/0.762/ 1.016/1.524/2.0/3.0 (Other thickness customizable)	0.0010	2.20±0 .04
	F4BM255		0.0013	2.55±0 .05
	F4BM265		0.0015	2.65±0 .05
	F4BM300		0.0017	3.0±0.05
	F4B350		0.0025	3.5±0.05
	F4BTM400		0.0030	4.00±0 .08
	F4BTM440		0.0033	4.40±0 .10
	F4BTM615		0.0045	6. 15±0 .12
Rogers	RO3035	0.127/0.254/0.508/0.762/ 1.524	0.0015	3.5
	RO4350	0.101/0.168/0.254/0.338/0.422/0.508/0.762/1.524	0.0037	3.48
	RO4003	0.203/0.305/0.406/0.508/0.813/ 1.524	0.0027	3.38
	RO3003	0.127/0.254/ 0.508/0.762/ 1.524	0.0010	3.0
	RO3006	0.127/0.254/0.635/1.270	0.0020	6.15
	RO3010		0.0022	10.2
	RT5880	0.127/0.254/0.381/0.508/ 0.787/ 1.570/3.175	0.0009	2.2
	RT5870		0.0012	2.33
	RO6010	0.127/0.254/0.635/1.27/ 1.905/2.54	0.0023	10.2
Taconic	TLY-5A	0.09 0.13 0.25 0.51 0.79 1.58 2.36 (Other thickness customizable)	0.0009	2.17
	TLP-5		0.0009	2.2
	TLY-5		0.0009	2.22
	TLY-3		0.0012	2.33
	TLT-0, 9, 8, 7, 6	0.4 0.13 0.25 0.51 0.79 1.58 3.18	0.0015-0.0021	2.45-2.65
	TLA-6	0.76 1.45	0.0017	2.65
	RF-35	0.25 0.51 0.76 1.52	0.0018	3.5
	RF-60A	0.25 0.64 0.79 1.27 1.52 3.18	0.0038	6.5
	CER-10	0.28 0.64 0.76 1.19 1.58 3.18	0.0035	10.0
ZY	ZYF220D	0.254/0.381/0.508/0.762/1.016/ 1.524	0.0009	2.20±0 .02
	ZYF225DA		0.0018	2.55±0 .04
	ZYF265D		0.0018	2.65±0 .04
	ZYF300CA-P	0.381/0.508/0.762/ 1.016/1.524/3.170	0.0018	3.00±0 .05
	ZYF350CA		0.0031	3.50±0 .05